ESD3V3D5-T
vs
SZESD5Z3.3T1G
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
MICRO COMMERCIAL COMPONENTS
|
ONSEMI
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.10.00.50
|
8541.10.00.50
|
| JESD-609 Code |
e0
|
e3
|
| Peak Reflow Temperature (Cel) |
240
|
260
|
| Terminal Finish |
TIN LEAD
|
Matte Tin (Sn) - annealed
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
Yes
|
| Manufacturer Package Code |
|
502-01
|
| Factory Lead Time |
|
4 Weeks
|
| Samacsys Manufacturer |
|
onsemi
|
| Additional Feature |
|
EXCELLENT CLAMPING CAPABILITY
|
| Breakdown Voltage-Min |
|
5 V
|
| Configuration |
|
SINGLE
|
| Diode Element Material |
|
SILICON
|
| Diode Type |
|
TRANS VOLTAGE SUPPRESSOR DIODE
|
| JESD-30 Code |
|
R-PDSO-F2
|
| Moisture Sensitivity Level |
|
1
|
| Non-rep Peak Rev Power Dis-Max |
|
158 W
|
| Number of Elements |
|
1
|
| Number of Terminals |
|
2
|
| Operating Temperature-Max |
|
150 °C
|
| Operating Temperature-Min |
|
-55 °C
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
SMALL OUTLINE
|
| Polarity |
|
UNIDIRECTIONAL
|
| Power Dissipation-Max |
|
0.5 W
|
| Reference Standard |
|
AEC-Q101; IEC-61000-4-2, 4-4
|
| Rep Pk Reverse Voltage-Max |
|
3.3 V
|
| Surface Mount |
|
YES
|
| Technology |
|
AVALANCHE
|
| Terminal Form |
|
FLAT
|
| Terminal Position |
|
DUAL
|
|
|
|
Compare ESD3V3D5-T with alternatives
Compare SZESD5Z3.3T1G with alternatives