ES3GH
vs
S3GHM3_A/H
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
TAIWAN SEMICONDUCTOR CO LTD
|
VISHAY INTERTECHNOLOGY INC
|
Package Description |
SMC, 2 PIN
|
SMC, 2 PIN
|
Reach Compliance Code |
unknown
|
not_compliant
|
Additional Feature |
FREE WHEELING DIODE, SNUBBER DIODE
|
FREE WHEELING DIODE, LOW LEAKAGE CURRENT
|
Application |
EFFICIENCY
|
GENERAL PURPOSE
|
Configuration |
SINGLE
|
SINGLE
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
Forward Voltage-Max (VF) |
1.3 V
|
1.15 V
|
JEDEC-95 Code |
DO-214AB
|
DO-214AB
|
JESD-30 Code |
R-PDSO-C2
|
R-PDSO-C2
|
Non-rep Pk Forward Current-Max |
100 A
|
100 A
|
Number of Elements |
1
|
1
|
Number of Phases |
1
|
1
|
Number of Terminals |
2
|
2
|
Operating Temperature-Max |
150 °C
|
150 °C
|
Operating Temperature-Min |
-55 °C
|
-55 °C
|
Output Current-Max |
3 A
|
3 A
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
Reference Standard |
AEC-Q101
|
AEC-Q101
|
Rep Pk Reverse Voltage-Max |
400 V
|
400 V
|
Reverse Current-Max |
10 µA
|
10 µA
|
Reverse Recovery Time-Max |
0.035 µs
|
2.5 µs
|
Surface Mount |
YES
|
YES
|
Terminal Form |
C BEND
|
C BEND
|
Terminal Position |
DUAL
|
DUAL
|
Base Number Matches |
1
|
1
|
ECCN Code |
|
EAR99
|
HTS Code |
|
8541.10.00.80
|
Factory Lead Time |
|
8 Weeks
|
Date Of Intro |
|
2017-09-05
|
JESD-609 Code |
|
e3
|
Moisture Sensitivity Level |
|
1
|
Peak Reflow Temperature (Cel) |
|
260
|
Reverse Test Voltage |
|
400 V
|
Terminal Finish |
|
MATTE TIN
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare ES3GH with alternatives
Compare S3GHM3_A/H with alternatives