ES1D
vs
GS1B-T
feature comparison
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
SANGDEST MICROELECTRONICS (NANJING) CO LTD
|
MICRO COMMERCIAL COMPONENTS
|
Package Description |
SMA, 2 PIN
|
|
Reach Compliance Code |
compliant
|
unknown
|
Additional Feature |
LOW POWER LOSS
|
|
Application |
EFFICIENCY
|
GENERAL PURPOSE
|
Configuration |
SINGLE
|
SINGLE
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
Forward Voltage-Max (VF) |
0.95 V
|
1.1 V
|
JESD-30 Code |
R-PDSO-C2
|
R-PDSO-C2
|
Non-rep Pk Forward Current-Max |
30 A
|
30 A
|
Number of Elements |
1
|
1
|
Number of Phases |
1
|
1
|
Number of Terminals |
2
|
2
|
Operating Temperature-Max |
150 °C
|
150 °C
|
Operating Temperature-Min |
-55 °C
|
-55 °C
|
Output Current-Max |
1 A
|
1 A
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
240
|
Qualification Status |
Not Qualified
|
|
Rep Pk Reverse Voltage-Max |
200 V
|
100 V
|
Reverse Current-Max |
5 µA
|
10 µA
|
Reverse Recovery Time-Max |
0.035 µs
|
|
Surface Mount |
YES
|
YES
|
Terminal Form |
C BEND
|
C BEND
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
30
|
Base Number Matches |
6
|
7
|
ECCN Code |
|
EAR99
|
HTS Code |
|
8541.10.00.80
|
Samacsys Manufacturer |
|
MCC
|
Breakdown Voltage-Min |
|
100 V
|
JEDEC-95 Code |
|
DO-214AC
|
JESD-609 Code |
|
e0
|
Moisture Sensitivity Level |
|
1
|
Reverse Test Voltage |
|
100 V
|
Terminal Finish |
|
TIN LEAD
|
|
|
|
Compare ES1D with alternatives
Compare GS1B-T with alternatives