ER3125QI
vs
LT3752EFE#PBF
feature comparison
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
ALTERA CORP
|
LINEAR TECHNOLOGY CORP
|
| Package Description |
HVQCCN,
|
TSSOP-38/31
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
OUTPUT VOLT IS ADJUSTABLE FROM 0.8V
|
|
| Analog IC - Other Type |
SWITCHING CONTROLLER
|
SWITCHING CONTROLLER
|
| Control Mode |
CURRENT-MODE
|
CURRENT-MODE
|
| Control Technique |
PULSE WIDTH MODULATION
|
PULSE WIDTH MODULATION
|
| Input Voltage-Max |
36 V
|
100 V
|
| Input Voltage-Min |
3 V
|
6.5 V
|
| Input Voltage-Nom |
12 V
|
12 V
|
| JESD-30 Code |
S-PQCC-N20
|
R-PDSO-G31
|
| Length |
4 mm
|
9.7 mm
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
20
|
31
|
| Operating Temperature-Max |
105 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
HTSSOP
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH
|
| Seated Height-Max |
1 mm
|
1.2 mm
|
| Surface Mount |
YES
|
YES
|
| Switcher Configuration |
BUCK-BOOST
|
|
| Switching Frequency-Max |
2200 kHz
|
|
| Temperature Grade |
INDUSTRIAL
|
AUTOMOTIVE
|
| Terminal Form |
NO LEAD
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Width |
4 mm
|
4.4 mm
|
| Base Number Matches |
2
|
2
|
| Rohs Code |
|
Yes
|
| Part Package Code |
|
TSSOP
|
| Pin Count |
|
38
|
| Manufacturer Package Code |
|
FE
|
| JESD-609 Code |
|
e3
|
| Package Equivalence Code |
|
TSSOP31/38,.25,20
|
| Terminal Finish |
|
MATTE TIN
|
|
|
|