ER2J-TP-HF
vs
ER2K
feature comparison
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
MICRO COMMERCIAL COMPONENTS CORP
|
MICRO COMMERCIAL COMPONENTS CORP
|
Package Description |
HSMB, 2 PIN
|
PLASTIC, HSMB, 2 PIN
|
Reach Compliance Code |
not_compliant
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8541.10.00.80
|
8541.10.00.80
|
Application |
EFFICIENCY
|
EFFICIENCY
|
Configuration |
SINGLE
|
SINGLE
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
Forward Voltage-Max (VF) |
1.35 V
|
1.7 V
|
JEDEC-95 Code |
DO-214AA
|
DO-214AA
|
JESD-30 Code |
R-PDSO-C2
|
R-PDSO-C2
|
Moisture Sensitivity Level |
1
|
|
Non-rep Pk Forward Current-Max |
50 A
|
50 A
|
Number of Elements |
1
|
1
|
Number of Phases |
1
|
1
|
Number of Terminals |
2
|
2
|
Operating Temperature-Max |
150 °C
|
|
Operating Temperature-Min |
-50 °C
|
|
Output Current-Max |
2 A
|
2 A
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
Peak Reflow Temperature (Cel) |
260
|
240
|
Rep Pk Reverse Voltage-Max |
600 V
|
800 V
|
Reverse Current-Max |
5 µA
|
5 µA
|
Reverse Recovery Time-Max |
0.06 µs
|
0.1 µs
|
Surface Mount |
YES
|
YES
|
Terminal Form |
C BEND
|
C BEND
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
10
|
30
|
Base Number Matches |
1
|
5
|
Part Package Code |
|
DO-214AA
|
Pin Count |
|
2
|
JESD-609 Code |
|
e0
|
Qualification Status |
|
Not Qualified
|
Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
|
|
|
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