EPM7256BTC144-5
vs
EPM7256ABI256-7
feature comparison
Pbfree Code |
No
|
|
Rohs Code |
No
|
|
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
ALTERA CORP
|
ALTERA CORP
|
Part Package Code |
QFP
|
BGA
|
Package Description |
TQFP-144
|
BGA,
|
Pin Count |
144
|
256
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Additional Feature |
YES
|
256 MACROCELLS
|
Clock Frequency-Max |
188.7 MHz
|
166.7 MHz
|
In-System Programmable |
YES
|
|
JESD-30 Code |
S-PQFP-G144
|
S-PBGA-B256
|
JESD-609 Code |
e0
|
e1
|
JTAG BST |
YES
|
|
Length |
20 mm
|
27 mm
|
Moisture Sensitivity Level |
3
|
|
Number of Dedicated Inputs |
|
|
Number of I/O Lines |
120
|
164
|
Number of Macro Cells |
256
|
|
Number of Terminals |
144
|
256
|
Operating Temperature-Max |
70 °C
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
Organization |
0 DEDICATED INPUTS, 120 I/O
|
0 DEDICATED INPUTS, 164 I/O
|
Output Function |
MACROCELL
|
MACROCELL
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LFQFP
|
BGA
|
Package Equivalence Code |
QFP144,.63SQ,20
|
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
FLATPACK, LOW PROFILE, FINE PITCH
|
GRID ARRAY
|
Peak Reflow Temperature (Cel) |
220
|
|
Programmable Logic Type |
EE PLD
|
EE PLD
|
Propagation Delay |
5 ns
|
7.5 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.6 mm
|
2.3 mm
|
Supply Voltage-Max |
2.625 V
|
3.6 V
|
Supply Voltage-Min |
2.375 V
|
3 V
|
Supply Voltage-Nom |
2.5 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
Terminal Finish |
TIN LEAD
|
TIN SILVER COPPER
|
Terminal Form |
GULL WING
|
BALL
|
Terminal Pitch |
0.5 mm
|
1.27 mm
|
Terminal Position |
QUAD
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
20
|
|
Width |
20 mm
|
27 mm
|
Base Number Matches |
2
|
1
|
|
|
|
Compare EPM7256BTC144-5 with alternatives
Compare EPM7256ABI256-7 with alternatives