EPM7256BFC100-10
vs
EPM3256ATI144-6
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
INTEL CORP
|
ALTERA CORP
|
| Package Description |
LBGA, BGA100,10X10,40
|
LFQFP, QFP144,.63SQ,20
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
YES
|
YES
|
| Clock Frequency-Max |
95.2 MHz
|
166.7 MHz
|
| In-System Programmable |
YES
|
YES
|
| JESD-30 Code |
S-PBGA-B100
|
S-PQFP-G144
|
| JESD-609 Code |
e0
|
e0
|
| JTAG BST |
YES
|
YES
|
| Length |
11 mm
|
20 mm
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of Dedicated Inputs |
4
|
|
| Number of I/O Lines |
84
|
116
|
| Number of Macro Cells |
256
|
256
|
| Number of Terminals |
100
|
144
|
| Organization |
4 DEDICATED INPUTS, 84 I/O
|
0 DEDICATED INPUTS, 116 I/O
|
| Output Function |
MACROCELL
|
MACROCELL
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LBGA
|
LFQFP
|
| Package Equivalence Code |
BGA100,10X10,40
|
QFP144,.63SQ,20
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, LOW PROFILE
|
FLATPACK, LOW PROFILE, FINE PITCH
|
| Programmable Logic Type |
EE PLD
|
EE PLD
|
| Propagation Delay |
10 ns
|
6 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.7 mm
|
1.6 mm
|
| Supply Voltage-Max |
2.625 V
|
3.6 V
|
| Supply Voltage-Min |
2.375 V
|
3 V
|
| Supply Voltage-Nom |
2.5 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
BALL
|
GULL WING
|
| Terminal Pitch |
1 mm
|
0.5 mm
|
| Terminal Position |
BOTTOM
|
QUAD
|
| Width |
11 mm
|
20 mm
|
| Base Number Matches |
2
|
1
|
| Part Package Code |
|
QFP
|
| Pin Count |
|
144
|
| Operating Temperature-Max |
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Peak Reflow Temperature (Cel) |
|
220
|
| Temperature Grade |
|
INDUSTRIAL
|
|
|
|
Compare EPM7256BFC100-10 with alternatives
Compare EPM3256ATI144-6 with alternatives