EPM7064BFC100-5N
vs
EPM7064BFI100-3
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
ALTERA CORP
|
ALTERA CORP
|
Part Package Code |
BGA
|
BGA
|
Package Description |
LBGA, BGA100,10X10,40
|
LBGA, BGA100,10X10,40
|
Pin Count |
100
|
100
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Additional Feature |
YES
|
YES
|
Clock Frequency-Max |
303 MHz
|
285.7 MHz
|
In-System Programmable |
YES
|
YES
|
JESD-30 Code |
S-PBGA-B100
|
S-PBGA-B100
|
JESD-609 Code |
e1
|
e0
|
JTAG BST |
YES
|
YES
|
Length |
11 mm
|
11 mm
|
Number of Dedicated Inputs |
|
|
Number of I/O Lines |
68
|
68
|
Number of Macro Cells |
64
|
64
|
Number of Terminals |
100
|
100
|
Operating Temperature-Max |
70 °C
|
|
Operating Temperature-Min |
|
|
Organization |
0 DEDICATED INPUTS, 68 I/O
|
0 DEDICATED INPUTS, 68 I/O
|
Output Function |
MACROCELL
|
MACROCELL
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LBGA
|
LBGA
|
Package Equivalence Code |
BGA100,10X10,40
|
BGA100,10X10,40
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, LOW PROFILE
|
GRID ARRAY, LOW PROFILE
|
Programmable Logic Type |
EE PLD
|
EE PLD
|
Propagation Delay |
3.5 ns
|
3.5 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.7 mm
|
1.7 mm
|
Supply Voltage-Max |
2.625 V
|
2.625 V
|
Supply Voltage-Min |
2.375 V
|
2.375 V
|
Supply Voltage-Nom |
2.5 V
|
2.5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
|
Terminal Finish |
TIN SILVER COPPER
|
TIN LEAD
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
11 mm
|
11 mm
|
Base Number Matches |
1
|
2
|
Moisture Sensitivity Level |
|
3
|
Peak Reflow Temperature (Cel) |
|
220
|
|
|
|
Compare EPM7064BFC100-5N with alternatives
Compare EPM7064BFI100-3 with alternatives