EPM3256AQC208-7
vs
EPM7256AEFC100-10
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
INTEL CORP
|
INTEL CORP
|
| Package Description |
PLASTIC, QFP-208
|
FINE LINE, BGA-100
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
Intel
|
Intel
|
| Additional Feature |
YES
|
YES
|
| Clock Frequency-Max |
126.6 MHz
|
95.2 MHz
|
| In-System Programmable |
YES
|
YES
|
| JESD-30 Code |
S-PQFP-G208
|
S-PBGA-B100
|
| JESD-609 Code |
e0
|
e0
|
| JTAG BST |
YES
|
YES
|
| Length |
28 mm
|
11 mm
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of Dedicated Inputs |
|
|
| Number of I/O Lines |
158
|
84
|
| Number of Macro Cells |
256
|
256
|
| Number of Terminals |
208
|
100
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Organization |
0 DEDICATED INPUTS, 158 I/O
|
0 DEDICATED INPUTS, 84 I/O
|
| Output Function |
MACROCELL
|
MACROCELL
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
FQFP
|
LBGA
|
| Package Equivalence Code |
QFP208,1.2SQ,20
|
BGA100,10X10,40
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, FINE PITCH
|
GRID ARRAY, LOW PROFILE
|
| Programmable Logic Type |
EE PLD
|
EE PLD
|
| Propagation Delay |
7.5 ns
|
10 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.1 mm
|
1.7 mm
|
| Supply Voltage-Max |
3.6 V
|
3.6 V
|
| Supply Voltage-Min |
3 V
|
3 V
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
GULL WING
|
BALL
|
| Terminal Pitch |
0.5 mm
|
1 mm
|
| Terminal Position |
QUAD
|
BOTTOM
|
| Width |
28 mm
|
11 mm
|
| Base Number Matches |
2
|
2
|
|
|
|
Compare EPM3256AQC208-7 with alternatives
Compare EPM7256AEFC100-10 with alternatives