EPM2210GF324C3N vs EPM2210GF324I5 feature comparison

EPM2210GF324C3N Altera Corporation

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EPM2210GF324I5 Altera Corporation

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Pbfree Code Yes No
Rohs Code Yes No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer ALTERA CORP ALTERA CORP
Part Package Code BGA BGA
Package Description 19 X 19 MM, 1 MM PITCH, LEAD FREE, FBGA-324 19 X 19 MM, 1 MM PITCH, FBGA-324
Pin Count 324 324
Reach Compliance Code unknown not_compliant
ECCN Code 3A991.D 3A991.D
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer Intel Intel
Additional Feature IT CAN ALSO OPERATE AT 3.3V YES
In-System Programmable YES YES
JESD-30 Code S-PBGA-B324 S-PBGA-B324
JESD-609 Code e1 e0
JTAG BST YES YES
Length 19 mm 19 mm
Moisture Sensitivity Level 3 3
Number of Dedicated Inputs
Number of I/O Lines 272 272
Number of Macro Cells 1700 1700
Number of Terminals 324 324
Operating Temperature-Max 85 °C
Operating Temperature-Min
Organization 0 DEDICATED INPUTS, 272 I/O 0 DEDICATED INPUTS, 272 I/O
Output Function MACROCELL MACROCELL
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA324,18X18,40 BGA324,18X18,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 260 220
Programmable Logic Type FLASH PLD FLASH PLD
Propagation Delay 7 ns 11.2 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.2 mm 2.2 mm
Supply Voltage-Max 1.89 V 1.89 V
Supply Voltage-Min 1.71 V 1.71 V
Supply Voltage-Nom 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER
Terminal Finish TIN SILVER COPPER TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 20
Width 19 mm 19 mm
Base Number Matches 1 2

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