EPM1270GF256I5
vs
EPM1270GF256C3
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
ALTERA CORP
ALTERA CORP
Part Package Code
BGA
BGA
Package Description
17 X 17 MM, 1 MM PITCH, FBGA-256
17 X 17 MM, 1 MM PITCH, FBGA-256
Pin Count
256
256
Reach Compliance Code
not_compliant
not_compliant
ECCN Code
3A991.D
3A991.D
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
YES
YES
In-System Programmable
YES
YES
JESD-30 Code
S-PBGA-B256
S-PBGA-B256
JESD-609 Code
e0
e0
JTAG BST
YES
YES
Length
17 mm
17 mm
Moisture Sensitivity Level
3
3
Number of Dedicated Inputs
Number of I/O Lines
212
212
Number of Macro Cells
980
980
Number of Terminals
256
256
Organization
0 DEDICATED INPUTS, 212 I/O
0 DEDICATED INPUTS, 212 I/O
Output Function
MACROCELL
MACROCELL
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA256,16X16,40
BGA256,16X16,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
220
220
Programmable Logic Type
FLASH PLD
FLASH PLD
Propagation Delay
10 ns
6.2 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.2 mm
2.2 mm
Supply Voltage-Max
1.89 V
1.89 V
Supply Voltage-Min
1.71 V
1.71 V
Supply Voltage-Nom
1.8 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
20
20
Width
17 mm
17 mm
Base Number Matches
2
2
Operating Temperature-Max
85 °C
Operating Temperature-Min
Temperature Grade
COMMERCIAL EXTENDED
Compare EPM1270GF256I5 with alternatives
Compare EPM1270GF256C3 with alternatives