EPM1270F256A4N
vs
EPM1270F256A4N
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Transferred
|
Active
|
Ihs Manufacturer |
ALTERA CORP
|
INTEL CORP
|
Part Package Code |
BGA
|
|
Package Description |
BGA, BGA256,16X16,40
|
17 X 17 MM, 1 MM PITCH, LEAD FREE, FBGA-256
|
Pin Count |
256
|
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
3A991.D
|
3A991.D
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Additional Feature |
IT CAN ALSO OPERATE AT 3.3V
|
IT CAN ALSO OPERATE AT 3.3V
|
In-System Programmable |
YES
|
YES
|
JESD-30 Code |
S-PBGA-B256
|
S-PBGA-B256
|
JESD-609 Code |
e1
|
e1
|
JTAG BST |
YES
|
YES
|
Length |
17 mm
|
17 mm
|
Number of Dedicated Inputs |
|
|
Number of I/O Lines |
212
|
212
|
Number of Macro Cells |
980
|
980
|
Number of Terminals |
256
|
256
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Organization |
0 DEDICATED INPUTS, 212 I/O
|
0 DEDICATED INPUTS, 212 I/O
|
Output Function |
MACROCELL
|
MACROCELL
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
BGA
|
Package Equivalence Code |
BGA256,16X16,40
|
BGA256,16X16,40
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Programmable Logic Type |
FLASH PLD
|
FLASH PLD
|
Propagation Delay |
8.1 ns
|
8.1 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
2.2 mm
|
2.2 mm
|
Supply Voltage-Max |
2.625 V
|
2.625 V
|
Supply Voltage-Min |
2.375 V
|
2.375 V
|
Supply Voltage-Nom |
2.5 V
|
2.5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
Terminal Finish |
TIN SILVER COPPER
|
TIN SILVER COPPER
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
17 mm
|
17 mm
|
Base Number Matches |
1
|
1
|
Clock Frequency-Max |
|
172.4 MHz
|
Number of Inputs |
|
212
|
Number of Outputs |
|
212
|
|
|
|
Compare EPM1270F256A4N with alternatives
Compare EPM1270F256A4N with alternatives