EPF8820ARC208-4 vs EPF8820ABC225-4 feature comparison

EPF8820ARC208-4 Altera Corporation

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EPF8820ABC225-4 Altera Corporation

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Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer ALTERA CORP ALTERA CORP
Part Package Code QFP BGA
Package Description HEAT SINK, POWER, QFP-208 BGA-225
Pin Count 208 225
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature 672 LOGIC ELEMENTS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V 672 LOGIC ELEMENTS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V
Clock Frequency-Max 357 MHz 357 MHz
JESD-30 Code S-PQFP-G208 S-PBGA-B225
JESD-609 Code e0 e0
Length 28 mm 27 mm
Moisture Sensitivity Level 3 3
Number of Dedicated Inputs 4 4
Number of I/O Lines 152 152
Number of Inputs 152 152
Number of Logic Cells 672 672
Number of Outputs 148 148
Number of Terminals 208 225
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 4 DEDICATED INPUTS, 152 I/O 4 DEDICATED INPUTS, 152 I/O
Output Function REGISTERED REGISTERED
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code FQFP BGA
Package Equivalence Code HQFP208,1.2SQ,20 BGA225,15X15
Package Shape SQUARE SQUARE
Package Style FLATPACK, FINE PITCH GRID ARRAY
Peak Reflow Temperature (Cel) 220 220
Programmable Logic Type LOADABLE PLD LOADABLE PLD
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.1 mm 2.3 mm
Supply Voltage-Max 5.25 V 5.25 V
Supply Voltage-Min 4.75 V 4.75 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form GULL WING BALL
Terminal Pitch 0.5 mm 1.5 mm
Terminal Position QUAD BOTTOM
Width 28 mm 27 mm
Base Number Matches 2 2

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