EPF8820ARC208-4
vs
EPF8820ABC225-2
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
ALTERA CORP
ALTERA CORP
Part Package Code
QFP
BGA
Package Description
HEAT SINK, POWER, QFP-208
BGA, BGA225,15X15
Pin Count
208
225
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
672 LOGIC ELEMENTS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V
672 LOGIC ELEMENTS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V
Clock Frequency-Max
357 MHz
417 MHz
JESD-30 Code
S-PQFP-G208
S-PBGA-B225
JESD-609 Code
e0
e0
Length
28 mm
27 mm
Moisture Sensitivity Level
3
Number of Dedicated Inputs
4
4
Number of I/O Lines
152
152
Number of Inputs
152
152
Number of Logic Cells
672
672
Number of Outputs
148
148
Number of Terminals
208
225
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
4 DEDICATED INPUTS, 152 I/O
4 DEDICATED INPUTS, 152 I/O
Output Function
REGISTERED
REGISTERED
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
FQFP
BGA
Package Equivalence Code
HQFP208,1.2SQ,20
BGA225,15X15
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK, FINE PITCH
GRID ARRAY
Peak Reflow Temperature (Cel)
220
220
Programmable Logic Type
LOADABLE PLD
LOADABLE PLD
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.1 mm
2.3 mm
Supply Voltage-Max
5.25 V
5.25 V
Supply Voltage-Min
4.75 V
4.75 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
GULL WING
BALL
Terminal Pitch
0.5 mm
1.5 mm
Terminal Position
QUAD
BOTTOM
Width
28 mm
27 mm
Base Number Matches
2
1
Compare EPF8820ARC208-4 with alternatives
Compare EPF8820ABC225-2 with alternatives