EPF6024AQC208-2N
vs
EPF6024ABC256-3N
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
INTEL CORP
|
INTEL CORP
|
| Package Description |
FQFP,
|
BGA,
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
Intel
|
|
| Additional Feature |
CAN ALSO BE USED 24000 LOGIC GATES
|
CAN ALSO BE USED 24000 LOGIC GATES
|
| Clock Frequency-Max |
153 MHz
|
133 MHz
|
| JESD-30 Code |
S-PQFP-G208
|
S-PBGA-B256
|
| JESD-609 Code |
e3
|
e1
|
| Length |
28 mm
|
27 mm
|
| Moisture Sensitivity Level |
3
|
|
| Number of Dedicated Inputs |
4
|
4
|
| Number of I/O Lines |
171
|
218
|
| Number of Inputs |
171
|
218
|
| Number of Outputs |
171
|
218
|
| Number of Terminals |
208
|
256
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
|
|
| Organization |
4 DEDICATED INPUTS, 171 I/O
|
4 DEDICATED INPUTS, 218 I/O
|
| Output Function |
MACROCELL
|
MACROCELL
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
FQFP
|
BGA
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, FINE PITCH
|
GRID ARRAY
|
| Programmable Logic Type |
LOADABLE PLD
|
LOADABLE PLD
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.1 mm
|
2.3 mm
|
| Supply Voltage-Max |
3.6 V
|
3.6 V
|
| Supply Voltage-Min |
3 V
|
3 V
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
OTHER
|
OTHER
|
| Terminal Finish |
MATTE TIN
|
TIN SILVER COPPER
|
| Terminal Form |
GULL WING
|
BALL
|
| Terminal Pitch |
0.5 mm
|
1.27 mm
|
| Terminal Position |
QUAD
|
BOTTOM
|
| Width |
28 mm
|
27 mm
|
| Base Number Matches |
1
|
1
|
| ECCN Code |
|
3A991.D
|
|
|
|
Compare EPF6024AQC208-2N with alternatives
Compare EPF6024ABC256-3N with alternatives