EPF6016QC208-3
vs
EPF6016QC208-3N
feature comparison
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
INTEL CORP
|
INTEL CORP
|
Package Description |
PLASTIC, QFP-208
|
PLASTIC, QFP-208
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Samacsys Manufacturer |
Intel
|
Intel
|
Additional Feature |
CAN ALSO BE USED 16000 LOGIC GATES
|
CAN ALSO BE USED 16000 LOGIC GATES
|
Clock Frequency-Max |
133 MHz
|
133 MHz
|
JESD-30 Code |
S-PQFP-G208
|
S-PQFP-G208
|
JESD-609 Code |
e0
|
e3
|
Length |
28 mm
|
28 mm
|
Moisture Sensitivity Level |
3
|
3
|
Number of Dedicated Inputs |
4
|
4
|
Number of I/O Lines |
171
|
171
|
Number of Inputs |
171
|
171
|
Number of Logic Cells |
1320
|
1320
|
Number of Outputs |
171
|
171
|
Number of Terminals |
208
|
208
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
|
|
Organization |
4 DEDICATED INPUTS, 171 I/O
|
4 DEDICATED INPUTS, 171 I/O
|
Output Function |
MACROCELL
|
MACROCELL
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
FQFP
|
FQFP
|
Package Equivalence Code |
QFP208,1.2SQ,20
|
QFP208,1.2SQ,20
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
FLATPACK, FINE PITCH
|
FLATPACK, FINE PITCH
|
Programmable Logic Type |
LOADABLE PLD
|
LOADABLE PLD
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
4.1 mm
|
4.1 mm
|
Supply Voltage-Max |
5.25 V
|
5.25 V
|
Supply Voltage-Min |
4.75 V
|
4.75 V
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
OTHER
|
OTHER
|
Terminal Finish |
TIN LEAD
|
MATTE TIN
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
QUAD
|
QUAD
|
Width |
28 mm
|
28 mm
|
Base Number Matches |
2
|
2
|
|
|
|
Compare EPF6016QC208-3 with alternatives
Compare EPF6016QC208-3N with alternatives