EPF6016ATC100-3N
vs
EPF6016ATC100-3
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
INTEL CORP
|
INTEL CORP
|
| Package Description |
LFQFP,
|
TQFP-100
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
Intel
|
|
| Additional Feature |
CAN ALSO BE USED 16000 LOGIC GATES
|
CAN ALSO BE USED 16000 LOGIC GATES
|
| Clock Frequency-Max |
133 MHz
|
133 MHz
|
| JESD-30 Code |
S-PQFP-G100
|
S-PQFP-G100
|
| JESD-609 Code |
e3
|
e0
|
| Length |
14 mm
|
14 mm
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of Dedicated Inputs |
4
|
4
|
| Number of I/O Lines |
81
|
81
|
| Number of Inputs |
81
|
81
|
| Number of Outputs |
81
|
81
|
| Number of Terminals |
100
|
100
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
|
|
| Organization |
4 DEDICATED INPUTS, 81 I/O
|
4 DEDICATED INPUTS, 81 I/O
|
| Output Function |
MACROCELL
|
MACROCELL
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LFQFP
|
LFQFP
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, LOW PROFILE, FINE PITCH
|
FLATPACK, LOW PROFILE, FINE PITCH
|
| Programmable Logic Type |
LOADABLE PLD
|
LOADABLE PLD
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.27 mm
|
1.27 mm
|
| Supply Voltage-Max |
3.6 V
|
3.6 V
|
| Supply Voltage-Min |
3 V
|
3 V
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
OTHER
|
OTHER
|
| Terminal Finish |
MATTE TIN
|
TIN LEAD
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
14 mm
|
14 mm
|
| Base Number Matches |
1
|
2
|
| Number of Logic Cells |
|
1320
|
| Package Equivalence Code |
|
QFP100,.63SQ,20
|
| Technology |
|
CMOS
|
|
|
|
Compare EPF6016ATC100-3N with alternatives
Compare EPF6016ATC100-3 with alternatives