EPF6016AFC100-1
vs
EPF6016AFC100-2
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
INTEL CORP
|
INTEL CORP
|
| Package Description |
LBGA, BGA100,10X10,40
|
FINE LINE, BGA-100
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Clock Frequency-Max |
172 MHz
|
153 MHz
|
| JESD-30 Code |
S-PBGA-B100
|
S-PBGA-B100
|
| JESD-609 Code |
e0
|
e0
|
| Length |
11 mm
|
11 mm
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of Dedicated Inputs |
4
|
4
|
| Number of I/O Lines |
81
|
81
|
| Number of Inputs |
81
|
81
|
| Number of Logic Cells |
1320
|
1320
|
| Number of Outputs |
81
|
81
|
| Number of Terminals |
100
|
100
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
|
|
| Organization |
4 DEDICATED INPUTS, 81 I/O
|
4 DEDICATED INPUTS, 81 I/O
|
| Output Function |
MACROCELL
|
MACROCELL
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LBGA
|
LBGA
|
| Package Equivalence Code |
BGA100,10X10,40
|
BGA100,10X10,40
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, LOW PROFILE
|
GRID ARRAY, LOW PROFILE
|
| Programmable Logic Type |
LOADABLE PLD
|
LOADABLE PLD
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.7 mm
|
1.7 mm
|
| Supply Voltage-Max |
3.6 V
|
3.6 V
|
| Supply Voltage-Min |
3 V
|
3 V
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
OTHER
|
OTHER
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
1 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Width |
11 mm
|
11 mm
|
| Base Number Matches |
2
|
2
|
| Factory Lead Time |
|
4 Weeks
|
| Samacsys Manufacturer |
|
Intel
|
|
|
|
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