EPF10K50VRC240-3N
vs
EPF10K50VRI240-4
feature comparison
Pbfree Code |
Yes
|
No
|
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
ALTERA CORP
|
ALTERA CORP
|
Part Package Code |
QFP
|
QFP
|
Package Description |
RQFP-240
|
RQFP-240
|
Pin Count |
240
|
240
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Samacsys Manufacturer |
Intel
|
|
JESD-30 Code |
S-PQFP-G240
|
S-PQFP-G240
|
JESD-609 Code |
e3
|
e0
|
Length |
32 mm
|
32 mm
|
Moisture Sensitivity Level |
3
|
3
|
Number of Dedicated Inputs |
4
|
4
|
Number of I/O Lines |
189
|
189
|
Number of Inputs |
189
|
189
|
Number of Logic Cells |
2880
|
2880
|
Number of Outputs |
189
|
189
|
Number of Terminals |
240
|
240
|
Operating Temperature-Max |
70 °C
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
Organization |
4 DEDICATED INPUTS, 189 I/O
|
4 DEDICATED INPUTS, 189 I/O
|
Output Function |
REGISTERED
|
REGISTERED
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
HFQFP
|
HFQFP
|
Package Equivalence Code |
HQFP240,1.37SQ,20
|
HQFP240,1.37SQ,20
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
FLATPACK, HEAT SINK/SLUG, FINE PITCH
|
FLATPACK, HEAT SINK/SLUG, FINE PITCH
|
Peak Reflow Temperature (Cel) |
245
|
220
|
Programmable Logic Type |
LOADABLE PLD
|
LOADABLE PLD
|
Propagation Delay |
0.5 ns
|
0.6 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
4.1 mm
|
4.1 mm
|
Supply Voltage-Max |
3.6 V
|
3.6 V
|
Supply Voltage-Min |
3 V
|
3 V
|
Supply Voltage-Nom |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
Terminal Finish |
MATTE TIN
|
TIN LEAD
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
QUAD
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
30
|
20
|
Width |
32 mm
|
32 mm
|
Base Number Matches |
2
|
2
|
|
|
|
Compare EPF10K50VRC240-3N with alternatives
Compare EPF10K50VRI240-4 with alternatives