EPF10K50SFC256-2N
vs
EPF10K50EFI256-1
feature comparison
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
INTEL CORP
|
ALTERA CORP
|
Package Description |
17 X 17 MM, 1 MM PITCH, FINE LINE, BGA-256
|
BGA, BGA256,16X16,40
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
JESD-30 Code |
S-PBGA-B256
|
S-PBGA-B256
|
JESD-609 Code |
e1
|
e0
|
Length |
17 mm
|
17 mm
|
Number of I/O Lines |
191
|
191
|
Number of Terminals |
256
|
256
|
Operating Temperature-Max |
70 °C
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
Organization |
191 I/O
|
191 I/O
|
Output Function |
MIXED
|
MIXED
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
BGA
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Programmable Logic Type |
LOADABLE PLD
|
LOADABLE PLD
|
Propagation Delay |
0.4 ns
|
8.5 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
2.1 mm
|
2.1 mm
|
Supply Voltage-Max |
2.625 V
|
2.7 V
|
Supply Voltage-Min |
2.375 V
|
2.3 V
|
Supply Voltage-Nom |
2.5 V
|
2.5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
Terminal Finish |
TIN SILVER COPPER
|
TIN LEAD
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
17 mm
|
17 mm
|
Base Number Matches |
2
|
1
|
Part Package Code |
|
BGA
|
Pin Count |
|
256
|
Moisture Sensitivity Level |
|
3
|
Number of Inputs |
|
191
|
Number of Logic Cells |
|
2880
|
Number of Outputs |
|
191
|
Package Equivalence Code |
|
BGA256,16X16,40
|
Peak Reflow Temperature (Cel) |
|
220
|
|
|
|
Compare EPF10K50SFC256-2N with alternatives
Compare EPF10K50EFI256-1 with alternatives