EPF10K50SBC356-1
vs
EPF10K50SBI356-2
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
INTEL CORP
|
ALTERA CORP
|
Package Description |
35 X 35 MM, 1.27 MM PITCH, BGA-356
|
LBGA, BGA356,26X26,50
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
3A991.D
|
3A991.D
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Factory Lead Time |
4 Weeks
|
|
JESD-30 Code |
S-PBGA-B356
|
S-PBGA-B356
|
JESD-609 Code |
e0
|
e0
|
Length |
35 mm
|
35 mm
|
Moisture Sensitivity Level |
3
|
|
Number of I/O Lines |
220
|
220
|
Number of Inputs |
220
|
220
|
Number of Logic Cells |
2880
|
2880
|
Number of Outputs |
220
|
220
|
Number of Terminals |
356
|
356
|
Operating Temperature-Max |
70 °C
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
Organization |
220 I/O
|
220 I/O
|
Output Function |
MIXED
|
MIXED
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LBGA
|
LBGA
|
Package Equivalence Code |
BGA356,26X26,50
|
BGA356,26X26,50
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, LOW PROFILE
|
GRID ARRAY, LOW PROFILE
|
Programmable Logic Type |
LOADABLE PLD
|
LOADABLE PLD
|
Propagation Delay |
0.3 ns
|
9.5 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.63 mm
|
1.63 mm
|
Supply Voltage-Max |
2.625 V
|
2.7 V
|
Supply Voltage-Min |
2.375 V
|
2.3 V
|
Supply Voltage-Nom |
2.5 V
|
2.5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
Terminal Finish |
TIN LEAD
|
TIN LEAD
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
35 mm
|
35 mm
|
Base Number Matches |
3
|
2
|
Part Package Code |
|
BGA
|
Pin Count |
|
356
|
Peak Reflow Temperature (Cel) |
|
220
|
|
|
|
Compare EPF10K50SBI356-2 with alternatives