EPF10K50EFC256-2 vs EPF10K50EFI256-2 feature comparison

EPF10K50EFC256-2 Altera Corporation

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EPF10K50EFI256-2 Altera Corporation

Buy Now Datasheet
Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer ALTERA CORP ALTERA CORP
Part Package Code BGA BGA
Package Description 17 X 17 MM, 1 MM PITCH, FINE LINE, BGA-256 17 X 17 MM, 1 MM PITCH, FINE LINE, BGA-256
Pin Count 256 256
Reach Compliance Code not_compliant not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature 2880 LOGIC ELEMENTS 2880 LOGIC ELEMENTS
Clock Frequency-Max 140 MHz 140 MHz
JESD-30 Code S-PBGA-B256 S-PBGA-B256
JESD-609 Code e0 e0
Length 17 mm 17 mm
Moisture Sensitivity Level 3 3
Number of I/O Lines 191 191
Number of Inputs 191 191
Number of Logic Cells 2880 2880
Number of Outputs 191 191
Number of Terminals 256 256
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 191 I/O 191 I/O
Output Function MIXED MIXED
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA256,16X16,40 BGA256,16X16,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 220 220
Programmable Logic Type LOADABLE PLD LOADABLE PLD
Propagation Delay 0.6 ns 0.6 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.1 mm 2.1 mm
Supply Voltage-Max 2.7 V 2.7 V
Supply Voltage-Min 2.3 V 2.3 V
Supply Voltage-Nom 2.5 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 20 20
Width 17 mm 17 mm
Base Number Matches 2 2
Samacsys Manufacturer Intel

Compare EPF10K50EFC256-2 with alternatives

Compare EPF10K50EFI256-2 with alternatives