EPF10K30ATI144-3N
vs
EPF10K30ATC144-2
feature comparison
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
INTEL CORP
|
INTEL CORP
|
Package Description |
TQFP-144
|
TQFP-144
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Samacsys Manufacturer |
Intel
|
|
Additional Feature |
1728 LOGIC ELEMENTS; 216 LABS
|
1728 LOGIC ELEMENTS; 216 LABS
|
Clock Frequency-Max |
80 MHz
|
80 MHz
|
JESD-30 Code |
S-PQFP-G144
|
S-PQFP-G144
|
JESD-609 Code |
e3
|
e0
|
Length |
20 mm
|
20 mm
|
Moisture Sensitivity Level |
3
|
3
|
Number of Dedicated Inputs |
4
|
4
|
Number of I/O Lines |
102
|
102
|
Number of Inputs |
102
|
246
|
Number of Logic Cells |
1728
|
1728
|
Number of Outputs |
102
|
246
|
Number of Terminals |
144
|
144
|
Operating Temperature-Max |
85 °C
|
70 °C
|
Operating Temperature-Min |
-40 °C
|
|
Organization |
4 DEDICATED INPUTS, 102 I/O
|
4 DEDICATED INPUTS, 102 I/O
|
Output Function |
REGISTERED
|
REGISTERED
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LFQFP
|
LFQFP
|
Package Equivalence Code |
QFP144,.63SQ,20
|
QFP144,.87SQ,20
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
FLATPACK, LOW PROFILE, FINE PITCH
|
FLATPACK, LOW PROFILE, FINE PITCH
|
Programmable Logic Type |
LOADABLE PLD
|
LOADABLE PLD
|
Propagation Delay |
0.9 ns
|
0.7 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.6 mm
|
1.6 mm
|
Supply Voltage-Max |
3.6 V
|
3.6 V
|
Supply Voltage-Min |
3 V
|
3 V
|
Supply Voltage-Nom |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
Terminal Finish |
MATTE TIN
|
TIN LEAD
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
QUAD
|
QUAD
|
Width |
20 mm
|
20 mm
|
Base Number Matches |
1
|
2
|
Factory Lead Time |
|
4 Weeks
|
|
|
|
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