EPF10K200SGC599-2
vs
EPF10K200EGI599-1
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
ALTERA CORP
|
ALTERA CORP
|
Part Package Code |
PGA
|
PGA
|
Package Description |
IPGA, SPGA599,47X47
|
IPGA, SPGA599,47X47
|
Pin Count |
599
|
599
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
3A991.D
|
3A991.D
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
JESD-30 Code |
S-CPGA-P599
|
S-CPGA-P599
|
JESD-609 Code |
e0
|
e0
|
Length |
62.484 mm
|
62.484 mm
|
Moisture Sensitivity Level |
1
|
1
|
Number of I/O Lines |
470
|
470
|
Number of Inputs |
470
|
470
|
Number of Logic Cells |
9984
|
9984
|
Number of Outputs |
470
|
470
|
Number of Terminals |
599
|
599
|
Operating Temperature-Max |
70 °C
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
Organization |
470 I/O
|
470 I/O
|
Output Function |
MIXED
|
MIXED
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
Package Code |
IPGA
|
IPGA
|
Package Equivalence Code |
SPGA599,47X47
|
SPGA599,47X47
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, INTERSTITIAL PITCH
|
GRID ARRAY, INTERSTITIAL PITCH
|
Peak Reflow Temperature (Cel) |
220
|
220
|
Programmable Logic Type |
LOADABLE PLD
|
LOADABLE PLD
|
Propagation Delay |
12 ns
|
10 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
5.08 mm
|
5.08 mm
|
Supply Voltage-Max |
2.7 V
|
2.7 V
|
Supply Voltage-Min |
2.3 V
|
2.3 V
|
Supply Voltage-Nom |
2.5 V
|
2.5 V
|
Surface Mount |
NO
|
NO
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
Terminal Finish |
TIN LEAD
|
TIN LEAD
|
Terminal Form |
PIN/PEG
|
PIN/PEG
|
Terminal Pitch |
2.54 mm
|
2.54 mm
|
Terminal Position |
PERPENDICULAR
|
PERPENDICULAR
|
Width |
62.484 mm
|
62.484 mm
|
Base Number Matches |
1
|
1
|
|
|
|
Compare EPF10K200SGC599-2 with alternatives
Compare EPF10K200EGI599-1 with alternatives