EPF10K200SFI672-2N vs EPF10K200SFC672-2X feature comparison

EPF10K200SFI672-2N Altera Corporation

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EPF10K200SFC672-2X Altera Corporation

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Pbfree Code Yes No
Rohs Code Yes No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer ALTERA CORP ALTERA CORP
Part Package Code BGA BGA
Package Description BGA, 27 X 27 MM, 1 MM PITCH, FINE LINE, BGA-672
Pin Count 672 672
Reach Compliance Code compliant compliant
ECCN Code 3A991.D 3A991.D
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code S-PBGA-B672 S-PBGA-B672
JESD-609 Code e1 e0
Length 27 mm 27 mm
Number of I/O Lines 470 470
Number of Terminals 672 672
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 470 I/O 470 I/O
Output Function MIXED MIXED
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA672,26X26,40 BGA672,26X26,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Programmable Logic Type LOADABLE PLD LOADABLE PLD
Propagation Delay 0.6 ns 0.6 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.1 mm 2.1 mm
Supply Voltage-Max 2.625 V 2.625 V
Supply Voltage-Min 2.375 V 2.375 V
Supply Voltage-Nom 2.5 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish TIN SILVER COPPER TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 27 mm 27 mm
Base Number Matches 1 1
Moisture Sensitivity Level 3
Number of Inputs 470
Number of Logic Cells 9984
Number of Outputs 470
Peak Reflow Temperature (Cel) 220

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