EPF10K200SFC672-2X
vs
EPF10K200SFC672-2
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
INTEL CORP
ALTERA CORP
Package Description
BGA, BGA672,26X26,40
27 X 27 MM, 1 MM PITCH, FINE LINE, BGA-672
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.D
3A991.D
HTS Code
8542.39.00.01
8542.39.00.01
Samacsys Manufacturer
Intel
JESD-30 Code
S-PBGA-B672
S-PBGA-B672
JESD-609 Code
e0
e0
Length
27 mm
27 mm
Moisture Sensitivity Level
3
3
Number of I/O Lines
470
470
Number of Inputs
470
470
Number of Logic Cells
9984
9984
Number of Outputs
470
470
Number of Terminals
672
672
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
470 I/O
470 I/O
Output Function
MIXED
MIXED
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA672,26X26,40
BGA672,26X26,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Programmable Logic Type
LOADABLE PLD
LOADABLE PLD
Propagation Delay
0.6 ns
0.6 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.1 mm
2.1 mm
Supply Voltage-Max
2.625 V
2.625 V
Supply Voltage-Min
2.375 V
2.375 V
Supply Voltage-Nom
2.5 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
27 mm
27 mm
Base Number Matches
1
3
Pbfree Code
Part Package Code
BGA
Pin Count
672
Peak Reflow Temperature (Cel)
220
Compare EPF10K200SFC672-2X with alternatives
Compare EPF10K200SFC672-2 with alternatives