EPF10K200EFC672-2 vs EPF10K200SFC672-2 feature comparison

EPF10K200EFC672-2 Intel Corporation

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EPF10K200SFC672-2 Altera Corporation

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Rohs Code No No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer INTEL CORP ALTERA CORP
Package Description 27 X 27 MM, 1 MM PITCH, FINE LINE, BGA-672 27 X 27 MM, 1 MM PITCH, FINE LINE, BGA-672
Reach Compliance Code compliant compliant
ECCN Code 3A991.D 3A991.D
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature 9984 LOGIC ELEMENTS
Clock Frequency-Max 140 MHz
JESD-30 Code S-PBGA-B672 S-PBGA-B672
JESD-609 Code e0 e0
Length 27 mm 27 mm
Moisture Sensitivity Level 3 3
Number of I/O Lines 470 470
Number of Inputs 470 470
Number of Logic Cells 9984 9984
Number of Outputs 470 470
Number of Terminals 672 672
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 470 I/O 470 I/O
Output Function MIXED MIXED
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA672,26X26,40 BGA672,26X26,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Programmable Logic Type LOADABLE PLD LOADABLE PLD
Propagation Delay 0.6 ns 0.6 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.1 mm 2.1 mm
Supply Voltage-Max 2.7 V 2.625 V
Supply Voltage-Min 2.3 V 2.375 V
Supply Voltage-Nom 2.5 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 27 mm 27 mm
Base Number Matches 2 2
Pbfree Code No
Part Package Code BGA
Pin Count 672
Peak Reflow Temperature (Cel) 220

Compare EPF10K200EFC672-2 with alternatives

Compare EPF10K200SFC672-2 with alternatives