EPF10K200EBI600-1
vs
EPF10K200SBC600-3N
feature comparison
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
ALTERA CORP
|
INTEL CORP
|
Part Package Code |
BGA
|
|
Package Description |
BGA, BGA600,35X35,50
|
BGA,
|
Pin Count |
600
|
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
3A991.D
|
3A991.D
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
JESD-30 Code |
S-PBGA-B600
|
S-PBGA-B600
|
JESD-609 Code |
e0
|
e1
|
Length |
45 mm
|
45 mm
|
Number of I/O Lines |
470
|
470
|
Number of Inputs |
470
|
|
Number of Logic Cells |
9984
|
|
Number of Outputs |
470
|
|
Number of Terminals |
600
|
600
|
Operating Temperature-Max |
85 °C
|
70 °C
|
Operating Temperature-Min |
-40 °C
|
|
Organization |
470 I/O
|
470 I/O
|
Output Function |
MIXED
|
MIXED
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
BGA
|
Package Equivalence Code |
BGA600,35X35,50
|
BGA600,35X35,50
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Peak Reflow Temperature (Cel) |
220
|
|
Programmable Logic Type |
LOADABLE PLD
|
LOADABLE PLD
|
Propagation Delay |
10 ns
|
0.8 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.93 mm
|
1.93 mm
|
Supply Voltage-Max |
2.7 V
|
2.625 V
|
Supply Voltage-Min |
2.3 V
|
2.375 V
|
Supply Voltage-Nom |
2.5 V
|
2.5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
Terminal Finish |
TIN LEAD
|
TIN SILVER COPPER
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
45 mm
|
45 mm
|
Base Number Matches |
1
|
2
|
|
|
|
Compare EPF10K200EBI600-1 with alternatives
Compare EPF10K200SBC600-3N with alternatives