EPF10K200EBC600-3N vs EPF10K200EBC600-3 feature comparison

EPF10K200EBC600-3N Intel Corporation

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EPF10K200EBC600-3 Altera Corporation

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Rohs Code Yes No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer INTEL CORP ALTERA CORP
Package Description BGA, 45 X 45 MM, 1.27 MM PITCH, BGA-600
Reach Compliance Code compliant not_compliant
ECCN Code 3A991.D 3A991.D
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature 9984 LOGIC ELEMENTS 9984 LOGIC ELEMENTS
Clock Frequency-Max 140 MHz 140 MHz
JESD-30 Code S-PBGA-B600 S-PBGA-B600
JESD-609 Code e1 e0
Length 45 mm 45 mm
Number of I/O Lines 470 470
Number of Terminals 600 600
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 470 I/O 470 I/O
Output Function MIXED MIXED
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Programmable Logic Type LOADABLE PLD LOADABLE PLD
Propagation Delay 0.8 ns 0.8 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.93 mm 1.93 mm
Supply Voltage-Max 2.7 V 2.7 V
Supply Voltage-Min 2.3 V 2.3 V
Supply Voltage-Nom 2.5 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN SILVER COPPER TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Width 45 mm 45 mm
Base Number Matches 2 2
Pbfree Code No
Part Package Code BGA
Pin Count 600
Moisture Sensitivity Level 3
Number of Inputs 470
Number of Logic Cells 9984
Number of Outputs 470
Package Equivalence Code BGA600,35X35,50
Peak Reflow Temperature (Cel) 220
Time@Peak Reflow Temperature-Max (s) 20

Compare EPF10K200EBC600-3N with alternatives

Compare EPF10K200EBC600-3 with alternatives