EPF10K200EBC600-2N
vs
EPF10K200SBC600-1
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
INTEL CORP
ALTERA CORP
Package Description
BGA,
45 X 45 MM, 1.27 MM PITCH, BGA-600
Reach Compliance Code
compliant
not_compliant
ECCN Code
3A991.D
3A991.D
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
S-PBGA-B600
S-PBGA-B600
JESD-609 Code
e1
e0
Length
45 mm
45 mm
Number of I/O Lines
470
470
Number of Terminals
600
600
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
470 I/O
470 I/O
Output Function
MIXED
MIXED
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA600,35X35,50
BGA600,35X35,50
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Programmable Logic Type
LOADABLE PLD
LOADABLE PLD
Propagation Delay
0.6 ns
0.3 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.93 mm
1.93 mm
Supply Voltage-Max
2.7 V
2.625 V
Supply Voltage-Min
2.3 V
2.375 V
Supply Voltage-Nom
2.5 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN SILVER COPPER
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Width
45 mm
45 mm
Base Number Matches
1
3
Pbfree Code
Part Package Code
BGA
Pin Count
600
Moisture Sensitivity Level
3
Number of Inputs
470
Number of Logic Cells
9984
Number of Outputs
470
Peak Reflow Temperature (Cel)
220
Time@Peak Reflow Temperature-Max (s)
20
Compare EPF10K200EBC600-2N with alternatives
Compare EPF10K200SBC600-1 with alternatives