EPF10K100EFC484-3
vs
EPF10K100EFC484-2
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
ALTERA CORP
INTEL CORP
Part Package Code
BGA
Package Description
23 X 23 MM, 1 MM PITCH, FINE LINE, BGA-484
23 X 23 MM, 1 MM PITCH, FINE LINE, BGA-484
Pin Count
484
Reach Compliance Code
not_compliant
compliant
ECCN Code
3A991.D
3A991.D
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
S-PBGA-B484
S-PBGA-B484
JESD-609 Code
e0
e0
Length
23 mm
23 mm
Moisture Sensitivity Level
3
3
Number of I/O Lines
338
338
Number of Inputs
338
338
Number of Logic Cells
4992
4992
Number of Outputs
338
338
Number of Terminals
484
484
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
338 I/O
338 I/O
Output Function
MIXED
MIXED
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA484,22X22,40
BGA484,22X22,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
220
Programmable Logic Type
LOADABLE PLD
LOADABLE PLD
Propagation Delay
0.7 ns
0.5 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.1 mm
2.1 mm
Supply Voltage-Max
2.625 V
2.625 V
Supply Voltage-Min
2.375 V
2.375 V
Supply Voltage-Nom
2.5 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
20
Width
23 mm
23 mm
Base Number Matches
2
2
Factory Lead Time
4 Weeks
Samacsys Manufacturer
Intel
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