EPF10K100EFC484-2XN
vs
EPF10K100EFC484-2
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
ALTERA CORP
INTEL CORP
Part Package Code
BGA
Package Description
BGA,
23 X 23 MM, 1 MM PITCH, FINE LINE, BGA-484
Pin Count
484
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.D
3A991.D
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
S-PBGA-B484
S-PBGA-B484
JESD-609 Code
e1
e0
Length
23 mm
23 mm
Moisture Sensitivity Level
3
3
Number of I/O Lines
338
338
Number of Terminals
484
484
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
338 I/O
338 I/O
Output Function
MIXED
MIXED
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
260
Programmable Logic Type
LOADABLE PLD
LOADABLE PLD
Propagation Delay
0.5 ns
0.5 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.1 mm
2.1 mm
Supply Voltage-Max
2.625 V
2.625 V
Supply Voltage-Min
2.375 V
2.375 V
Supply Voltage-Nom
2.5 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
40
Width
23 mm
23 mm
Base Number Matches
2
2
Factory Lead Time
4 Weeks
Samacsys Manufacturer
Intel
Number of Inputs
338
Number of Logic Cells
4992
Number of Outputs
338
Package Equivalence Code
BGA484,22X22,40
Compare EPF10K100EFC484-2XN with alternatives
Compare EPF10K100EFC484-2 with alternatives