EPF10K100EFC484-1N
vs
EPF10K100EFC484-2X
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
INTEL CORP
ALTERA CORP
Package Description
BGA, BGA484,22X22,40
23 X 23 MM, 1 MM PITCH, FINE LINE, BGA-484
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.D
3A991.D
HTS Code
8542.39.00.01
8542.39.00.01
Samacsys Manufacturer
Intel
JESD-30 Code
S-PBGA-B484
S-PBGA-B484
JESD-609 Code
e1
e0
Length
23 mm
23 mm
Moisture Sensitivity Level
3
3
Number of I/O Lines
338
338
Number of Inputs
338
338
Number of Logic Cells
4992
4992
Number of Outputs
338
338
Number of Terminals
484
484
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
338 I/O
338 I/O
Output Function
MIXED
MIXED
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA484,22X22,40
BGA484,22X22,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Programmable Logic Type
LOADABLE PLD
LOADABLE PLD
Propagation Delay
0.4 ns
0.5 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.1 mm
2.1 mm
Supply Voltage-Max
2.625 V
2.625 V
Supply Voltage-Min
2.375 V
2.375 V
Supply Voltage-Nom
2.5 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN SILVER COPPER
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
23 mm
23 mm
Base Number Matches
2
2
Pbfree Code
Part Package Code
BGA
Pin Count
484
Peak Reflow Temperature (Cel)
220
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