EPF10K100EBC356-2N
vs
EPF10K100EBC356-2XN
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
INTEL CORP
|
INTEL CORP
|
Package Description |
LBGA, BGA356,26X26,50
|
LBGA,
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
3A991.D
|
3A991.D
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
JESD-30 Code |
S-PBGA-B356
|
S-PBGA-B356
|
JESD-609 Code |
e1
|
e1
|
Length |
35 mm
|
35 mm
|
Moisture Sensitivity Level |
3
|
|
Number of I/O Lines |
274
|
274
|
Number of Inputs |
274
|
|
Number of Logic Cells |
4992
|
|
Number of Outputs |
274
|
|
Number of Terminals |
356
|
356
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
|
|
Organization |
274 I/O
|
274 I/O
|
Output Function |
MIXED
|
MIXED
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LBGA
|
LBGA
|
Package Equivalence Code |
BGA356,26X26,50
|
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, LOW PROFILE
|
GRID ARRAY, LOW PROFILE
|
Programmable Logic Type |
LOADABLE PLD
|
LOADABLE PLD
|
Propagation Delay |
0.5 ns
|
0.5 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.63 mm
|
1.63 mm
|
Supply Voltage-Max |
2.625 V
|
2.625 V
|
Supply Voltage-Min |
2.375 V
|
2.375 V
|
Supply Voltage-Nom |
2.5 V
|
2.5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
Terminal Finish |
TIN SILVER COPPER
|
TIN SILVER COPPER
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
35 mm
|
35 mm
|
Base Number Matches |
1
|
1
|
|
|
|
Compare EPF10K100EBC356-2N with alternatives
Compare EPF10K100EBC356-2XN with alternatives