EPF10K100BFI256-3
vs
EPF10K130EQC240-2X
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
ALTERA CORP
|
INTEL CORP
|
| Part Package Code |
BGA
|
|
| Package Description |
BGA, BGA256,16X16,40
|
FQFP, QFP240,1.3SQ,20
|
| Pin Count |
256
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| JESD-30 Code |
S-PBGA-B256
|
S-PQFP-G240
|
| JESD-609 Code |
e0
|
e0
|
| Length |
17 mm
|
32 mm
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of I/O Lines |
191
|
186
|
| Number of Inputs |
191
|
186
|
| Number of Logic Cells |
4992
|
6656
|
| Number of Outputs |
191
|
186
|
| Number of Terminals |
256
|
240
|
| Operating Temperature-Max |
85 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Organization |
191 I/O
|
186 I/O
|
| Output Function |
MIXED
|
MIXED
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
FQFP
|
| Package Equivalence Code |
BGA256,16X16,40
|
QFP240,1.3SQ,20
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
FLATPACK, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
220
|
|
| Programmable Logic Type |
LOADABLE PLD
|
LOADABLE PLD
|
| Propagation Delay |
14.5 ns
|
0.5 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.1 mm
|
4.1 mm
|
| Supply Voltage-Max |
2.7 V
|
2.625 V
|
| Supply Voltage-Min |
2.3 V
|
2.375 V
|
| Supply Voltage-Nom |
2.5 V
|
2.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
BALL
|
GULL WING
|
| Terminal Pitch |
1 mm
|
0.5 mm
|
| Terminal Position |
BOTTOM
|
QUAD
|
| Width |
17 mm
|
32 mm
|
| Base Number Matches |
1
|
2
|
|
|
|
Compare EPF10K100BFI256-3 with alternatives