EPF10K100ABI600-2 vs EPF10K100ABI600-2 feature comparison

EPF10K100ABI600-2 Altera Corporation

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EPF10K100ABI600-2 Intel Corporation

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Pbfree Code No
Rohs Code No No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer ALTERA CORP INTEL CORP
Part Package Code BGA
Package Description BGA-600 BGA-600
Pin Count 600
Reach Compliance Code not_compliant compliant
ECCN Code 3A991.D 3A991.D
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code S-PBGA-B600 S-PBGA-B600
JESD-609 Code e0 e0
Length 45 mm 45 mm
Moisture Sensitivity Level 3 3
Number of Dedicated Inputs 4 4
Number of I/O Lines 406 406
Number of Inputs 406 406
Number of Logic Cells 4992 4992
Number of Outputs 406 406
Number of Terminals 600 600
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 4 DEDICATED INPUTS, 406 I/O 4 DEDICATED INPUTS, 406 I/O
Output Function REGISTERED REGISTERED
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA600,35X35,50 BGA600,35X35,50
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 220
Programmable Logic Type LOADABLE PLD LOADABLE PLD
Propagation Delay 0.7 ns 0.7 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.93 mm 1.93 mm
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 3 V 3 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 20
Width 45 mm 45 mm
Base Number Matches 2 2

Compare EPF10K100ABI600-2 with alternatives

Compare EPF10K100ABI600-2 with alternatives