EPF10K100ABI600-2
vs
EPF10K100ABC600-3
feature comparison
Pbfree Code |
No
|
No
|
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
ALTERA CORP
|
ALTERA CORP
|
Part Package Code |
BGA
|
BGA
|
Package Description |
BGA-600
|
BGA-600
|
Pin Count |
600
|
600
|
Reach Compliance Code |
not_compliant
|
not_compliant
|
ECCN Code |
3A991.D
|
3A991.D
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
JESD-30 Code |
S-PBGA-B600
|
S-PBGA-B600
|
JESD-609 Code |
e0
|
e0
|
Length |
45 mm
|
45 mm
|
Moisture Sensitivity Level |
3
|
3
|
Number of Dedicated Inputs |
4
|
4
|
Number of I/O Lines |
406
|
406
|
Number of Inputs |
406
|
406
|
Number of Logic Cells |
4992
|
4992
|
Number of Outputs |
406
|
406
|
Number of Terminals |
600
|
600
|
Operating Temperature-Max |
85 °C
|
70 °C
|
Operating Temperature-Min |
-40 °C
|
|
Organization |
4 DEDICATED INPUTS, 406 I/O
|
4 DEDICATED INPUTS, 406 I/O
|
Output Function |
REGISTERED
|
REGISTERED
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
BGA
|
Package Equivalence Code |
BGA600,35X35,50
|
BGA600,35X35,50
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Peak Reflow Temperature (Cel) |
220
|
220
|
Programmable Logic Type |
LOADABLE PLD
|
LOADABLE PLD
|
Propagation Delay |
0.7 ns
|
0.8 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.93 mm
|
1.93 mm
|
Supply Voltage-Max |
3.6 V
|
3.6 V
|
Supply Voltage-Min |
3 V
|
3 V
|
Supply Voltage-Nom |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
Terminal Finish |
TIN LEAD
|
TIN LEAD
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
20
|
20
|
Width |
45 mm
|
45 mm
|
Base Number Matches |
2
|
2
|
Samacsys Manufacturer |
|
Intel
|
|
|
|
Compare EPF10K100ABI600-2 with alternatives
Compare EPF10K100ABC600-3 with alternatives