EPF10K100ABC600-2
vs
EPF10K100ABC600-2
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
ALTERA CORP
INTEL CORP
Part Package Code
BGA
Package Description
BGA-600
BGA, BGA600,35X35,50
Pin Count
600
Reach Compliance Code
not_compliant
compliant
ECCN Code
3A991.D
3A991.D
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
S-PBGA-B600
S-PBGA-B600
JESD-609 Code
e0
e0
Length
45 mm
45 mm
Moisture Sensitivity Level
3
3
Number of Dedicated Inputs
4
4
Number of I/O Lines
406
406
Number of Inputs
406
406
Number of Logic Cells
4992
4992
Number of Outputs
406
406
Number of Terminals
600
600
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
4 DEDICATED INPUTS, 406 I/O
4 DEDICATED INPUTS, 406 I/O
Output Function
REGISTERED
REGISTERED
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA600,35X35,50
BGA600,35X35,50
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
220
Programmable Logic Type
LOADABLE PLD
LOADABLE PLD
Propagation Delay
0.7 ns
0.7 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.93 mm
1.93 mm
Supply Voltage-Max
3.6 V
3.6 V
Supply Voltage-Min
3 V
3 V
Supply Voltage-Nom
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
20
Width
45 mm
45 mm
Base Number Matches
2
2
Samacsys Manufacturer
Intel
Compare EPF10K100ABC600-2 with alternatives
Compare EPF10K100ABC600-2 with alternatives