EPF10K100ABC600-1
vs
EPF10K100ABC600-1N
feature comparison
| Pbfree Code |
No
|
Yes
|
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
ALTERA CORP
|
ALTERA CORP
|
| Part Package Code |
BGA
|
BGA
|
| Package Description |
BGA-600
|
BGA,
|
| Pin Count |
600
|
600
|
| Reach Compliance Code |
not_compliant
|
compliant
|
| ECCN Code |
3A991.D
|
3A991.D
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
Intel
|
|
| JESD-30 Code |
S-PBGA-B600
|
S-PBGA-B600
|
| JESD-609 Code |
e0
|
e1
|
| Length |
45 mm
|
45 mm
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of Dedicated Inputs |
4
|
4
|
| Number of I/O Lines |
406
|
406
|
| Number of Inputs |
406
|
|
| Number of Logic Cells |
4992
|
|
| Number of Outputs |
406
|
|
| Number of Terminals |
600
|
600
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Organization |
4 DEDICATED INPUTS, 406 I/O
|
4 DEDICATED INPUTS, 406 I/O
|
| Output Function |
REGISTERED
|
REGISTERED
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
BGA
|
| Package Equivalence Code |
BGA600,35X35,50
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Peak Reflow Temperature (Cel) |
220
|
|
| Programmable Logic Type |
LOADABLE PLD
|
LOADABLE PLD
|
| Propagation Delay |
0.6 ns
|
0.6 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.93 mm
|
1.93 mm
|
| Supply Voltage-Max |
3.6 V
|
3.6 V
|
| Supply Voltage-Min |
3 V
|
3 V
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
TIN LEAD
|
TIN SILVER COPPER
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
20
|
|
| Width |
45 mm
|
45 mm
|
| Base Number Matches |
2
|
1
|
|
|
|
Compare EPF10K100ABC600-1 with alternatives