EPF10K100ABC356-2 vs EPF10K100ABC356-3 feature comparison

EPF10K100ABC356-2 Intel Corporation

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EPF10K100ABC356-3 Intel Corporation

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEL CORP INTEL CORP
Package Description BGA-356 BGA-356
Reach Compliance Code compliant compliant
ECCN Code 3A991.D 3A991.D
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer Intel Intel
JESD-30 Code S-PBGA-B356 S-PBGA-B356
JESD-609 Code e0 e0
Length 35 mm 35 mm
Moisture Sensitivity Level 3 3
Number of Dedicated Inputs 4 4
Number of I/O Lines 274 274
Number of Inputs 274 274
Number of Logic Cells 4992 4992
Number of Outputs 274 274
Number of Terminals 356 356
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 4 DEDICATED INPUTS, 274 I/O 4 DEDICATED INPUTS, 274 I/O
Output Function REGISTERED REGISTERED
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Equivalence Code BGA356,26X26,50 BGA356,26X26,50
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Programmable Logic Type LOADABLE PLD LOADABLE PLD
Propagation Delay 0.7 ns 0.8 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.63 mm 1.63 mm
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 3 V 3 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Width 35 mm 35 mm
Base Number Matches 2 2

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