EPC1064VPI vs XC1765DDD8M feature comparison

EPC1064VPI Altera Corporation

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XC1765DDD8M AMD Xilinx

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Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer ALTERA CORP XILINX INC
Part Package Code DIP DIP
Package Description DIP, CERAMIC, DIP-8
Pin Count 8 8
Reach Compliance Code compliant compliant
ECCN Code EAR99
HTS Code 8542.32.00.51
Additional Feature 4 WIRE INTERFACE TO FLEX 8000 DEVICES
JESD-30 Code R-PDIP-T8 R-GDIP-T8
JESD-609 Code e0 e0
Length 9.398 mm 10.16 mm
Memory Density 65536 bit 65536 bit
Memory IC Type CONFIGURATION MEMORY CONFIGURATION MEMORY
Memory Width 1 1
Number of Functions 1 1
Number of Terminals 8 8
Number of Words 65536 words 65536 words
Number of Words Code 64000 64000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Organization 64KX1 64KX1
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial SERIAL SERIAL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.318 mm 5.08 mm
Supply Voltage-Max (Vsup) 3.6 V 5.5 V
Supply Voltage-Min (Vsup) 3 V 4.5 V
Supply Voltage-Nom (Vsup) 3.3 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Finish TIN LEAD TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Base Number Matches 2 2
Clock Frequency-Max (fCLK) 5 MHz
I/O Type COMMON
Package Equivalence Code DIP8,.3
Peak Reflow Temperature (Cel) NOT SPECIFIED
Power Supplies 5 V
Standby Current-Max 0.0015 A
Supply Current-Max 0.01 mA
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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