EP4SGX70DF29I3N
vs
EP4SGX70DF29I3
feature comparison
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
INTEL CORP
|
ALTERA CORP
|
Package Description |
29 X 29 MM, LEAD FREE, FBGA-780
|
29 X 29 MM, FBGA-780
|
Reach Compliance Code |
compliant
|
not_compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Clock Frequency-Max |
717 MHz
|
717 MHz
|
JESD-30 Code |
S-PBGA-B780
|
S-PBGA-B780
|
JESD-609 Code |
e1
|
e0
|
Length |
29 mm
|
29 mm
|
Number of CLBs |
2904
|
2904
|
Number of Inputs |
372
|
372
|
Number of Logic Cells |
72600
|
72600
|
Number of Outputs |
372
|
372
|
Number of Terminals |
780
|
780
|
Operating Temperature-Max |
100 °C
|
|
Operating Temperature-Min |
-40 °C
|
|
Organization |
2904 CLBS
|
2904 CLBS
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
BGA
|
Package Equivalence Code |
BGA780,28X28,40
|
BGA780,28X28,40
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
3.3 mm
|
3.3 mm
|
Supply Voltage-Max |
0.93 V
|
0.93 V
|
Supply Voltage-Min |
0.87 V
|
0.87 V
|
Supply Voltage-Nom |
0.9 V
|
0.9 V
|
Surface Mount |
YES
|
YES
|
Terminal Finish |
TIN SILVER COPPER
|
TIN LEAD
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
29 mm
|
29 mm
|
Base Number Matches |
2
|
2
|
Pbfree Code |
|
No
|
Part Package Code |
|
BGA
|
Pin Count |
|
780
|
Moisture Sensitivity Level |
|
3
|
Peak Reflow Temperature (Cel) |
|
220
|
Technology |
|
CMOS
|
Time@Peak Reflow Temperature-Max (s) |
|
20
|
|
|
|
Compare EP4SGX70DF29I3N with alternatives
Compare EP4SGX70DF29I3 with alternatives