EP4SGX360KF40I3G
vs
EP4SGX360KF40I3N
feature comparison
Part Life Cycle Code |
Active
|
Transferred
|
Ihs Manufacturer |
INTEL CORP
|
ALTERA CORP
|
Package Description |
FBGA-1517
|
LEAD FREE, FBGA-1517
|
Reach Compliance Code |
compliant
|
not_compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
JESD-30 Code |
S-PBGA-B1517
|
S-PBGA-B1517
|
Length |
40 mm
|
40 mm
|
Number of CLBs |
14144
|
141440
|
Number of Inputs |
744
|
744
|
Number of Logic Cells |
353600
|
353600
|
Number of Outputs |
744
|
744
|
Number of Terminals |
1517
|
1517
|
Operating Temperature-Max |
100 °C
|
|
Operating Temperature-Min |
-40 °C
|
|
Organization |
14144 CLBS
|
141440 CLBS
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
BGA
|
Package Equivalence Code |
BGA1517,39X39,40
|
BGA1517,39X39,40
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
245
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Seated Height-Max |
3.5 mm
|
3.6 mm
|
Supply Voltage-Max |
0.93 V
|
0.93 V
|
Supply Voltage-Min |
0.87 V
|
0.87 V
|
Supply Voltage-Nom |
0.9 V
|
0.9 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
INDUSTRIAL
|
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
30
|
Width |
40 mm
|
40 mm
|
Base Number Matches |
1
|
1
|
Pbfree Code |
|
Yes
|
Rohs Code |
|
Yes
|
Part Package Code |
|
BGA
|
Pin Count |
|
1517
|
Samacsys Manufacturer |
|
Intel
|
Clock Frequency-Max |
|
717 MHz
|
JESD-609 Code |
|
e1
|
Moisture Sensitivity Level |
|
3
|
Qualification Status |
|
Not Qualified
|
Technology |
|
CMOS
|
Terminal Finish |
|
TIN SILVER COPPER
|
|
|
|
Compare EP4SGX360KF40I3G with alternatives
Compare EP4SGX360KF40I3N with alternatives