EP4SGX360HF35C4
vs
EP4SGX360FF35C2X
feature comparison
All Stats
Differences Only
Pbfree Code
No
No
Rohs Code
No
No
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
ALTERA CORP
ALTERA CORP
Part Package Code
BGA
BGA
Package Description
FBGA-1152
35 X 35 MM, FBGA-1152
Pin Count
1152
1152
Reach Compliance Code
not_compliant
not_compliant
HTS Code
8542.39.00.01
8542.39.00.01
Clock Frequency-Max
717 MHz
800 MHz
JESD-30 Code
S-PBGA-B1152
S-PBGA-B1152
JESD-609 Code
e0
e0
Length
35 mm
35 mm
Moisture Sensitivity Level
4
3
Number of CLBs
141440
14144
Number of Inputs
564
564
Number of Logic Cells
353600
353600
Number of Outputs
564
564
Number of Terminals
1152
1152
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
Organization
141440 CLBS
14144 CLBS
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA1152,34X34,40
BGA1152,34X34,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
220
220
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3.6 mm
3.4 mm
Supply Voltage-Max
0.93 V
0.93 V
Supply Voltage-Min
0.87 V
0.87 V
Supply Voltage-Nom
0.9 V
0.9 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
OTHER
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
20
20
Width
35 mm
35 mm
Base Number Matches
2
2
Compare EP4SGX360HF35C4 with alternatives
Compare EP4SGX360FF35C2X with alternatives