EP4SGX360FH29I4 vs EP4SGX360FH29C4N feature comparison

EP4SGX360FH29I4 Intel Corporation

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EP4SGX360FH29C4N Altera Corporation

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Rohs Code No Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer INTEL CORP ALTERA CORP
Package Description 33 X 33 MM, HBGA-780 33 X 33 MM, LEAD FREE, HBGA-780
Reach Compliance Code compliant not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 717 MHz 717 MHz
JESD-30 Code S-PBGA-B780 S-PBGA-B780
JESD-609 Code e0 e1
Length 33 mm 33 mm
Number of CLBs 14144 14144
Number of Inputs 289 289
Number of Logic Cells 353600 353600
Number of Outputs 289 289
Number of Terminals 780 780
Operating Temperature-Max 100 °C 85 °C
Operating Temperature-Min -40 °C
Organization 14144 CLBS 14144 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA780,28X28,40 BGA780,28X28,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.4 mm 3.4 mm
Supply Voltage-Max 0.93 V 0.93 V
Supply Voltage-Min 0.87 V 0.87 V
Supply Voltage-Nom 0.9 V 0.9 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Finish TIN LEAD TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 33 mm 33 mm
Base Number Matches 2 2
Pbfree Code Yes
Part Package Code BGA
Pin Count 780
Moisture Sensitivity Level 4
Peak Reflow Temperature (Cel) 245
Temperature Grade OTHER
Time@Peak Reflow Temperature-Max (s) 30

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Compare EP4SGX360FH29C4N with alternatives