EP4SGX360FH29C4N
vs
EP4SGX360FH29I3N
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
ALTERA CORP
|
INTEL CORP
|
| Part Package Code |
BGA
|
|
| Package Description |
33 X 33 MM, LEAD FREE, HBGA-780
|
33 X 33 MM, LEAD FREE, HBGA-780
|
| Pin Count |
780
|
|
| Reach Compliance Code |
not_compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Clock Frequency-Max |
717 MHz
|
717 MHz
|
| JESD-30 Code |
S-PBGA-B780
|
S-PBGA-B780
|
| JESD-609 Code |
e1
|
e1
|
| Length |
33 mm
|
33 mm
|
| Moisture Sensitivity Level |
4
|
|
| Number of CLBs |
14144
|
14144
|
| Number of Inputs |
289
|
|
| Number of Logic Cells |
353600
|
353600
|
| Number of Outputs |
289
|
|
| Number of Terminals |
780
|
780
|
| Operating Temperature-Max |
85 °C
|
100 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Organization |
14144 CLBS
|
14144 CLBS
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
BGA
|
| Package Equivalence Code |
BGA780,28X28,40
|
BGA780,28X28,40
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Peak Reflow Temperature (Cel) |
245
|
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
3.4 mm
|
3.4 mm
|
| Supply Voltage-Max |
0.93 V
|
0.93 V
|
| Supply Voltage-Min |
0.87 V
|
0.87 V
|
| Supply Voltage-Nom |
0.9 V
|
0.9 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
|
| Temperature Grade |
OTHER
|
|
| Terminal Finish |
TIN SILVER COPPER
|
TIN SILVER COPPER
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
1 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
33 mm
|
33 mm
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare EP4SGX360FH29C4N with alternatives
Compare EP4SGX360FH29I3N with alternatives