Findchips: Compare EP4SGX360FH29C2X vs EP4SGX360FH29C3

EP4SGX360FH29C2X vs EP4SGX360FH29C3 feature comparison

Buy Now Datasheet

Buy Now Datasheet

Rohs Code	No	No
Part Life Cycle Code	Obsolete	Transferred
Ihs Manufacturer	INTEL CORP	ALTERA CORP
Package Description	33 X 33 MM, HBGA-780	33 X 33 MM, HBGA-780
Reach Compliance Code	compliant	not_compliant
HTS Code	8542.39.00.01	8542.39.00.01
Clock Frequency-Max	800 MHz	717 MHz
JESD-30 Code	S-PBGA-B780	S-PBGA-B780
JESD-609 Code	e0	e0
Length	33 mm	33 mm
Number of CLBs	14144	14144
Number of Inputs	289	289
Number of Logic Cells	353600	353600
Number of Outputs	289	289
Number of Terminals	780	780
Operating Temperature-Max	85 °C	85 °C
Operating Temperature-Min
Organization	14144 CLBS	14144 CLBS
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	BGA	BGA
Package Equivalence Code	BGA780,28X28,40	BGA780,28X28,40
Package Shape	SQUARE	SQUARE
Package Style	GRID ARRAY	GRID ARRAY
Programmable Logic Type	FIELD PROGRAMMABLE GATE ARRAY	FIELD PROGRAMMABLE GATE ARRAY
Qualification Status	Not Qualified	Not Qualified
Seated Height-Max	3.4 mm	3.4 mm
Supply Voltage-Max	0.93 V	0.93 V
Supply Voltage-Min	0.87 V	0.87 V
Supply Voltage-Nom	0.9 V	0.9 V
Surface Mount	YES	YES
Technology	CMOS	CMOS
Temperature Grade	OTHER	OTHER
Terminal Finish	TIN LEAD	TIN LEAD
Terminal Form	BALL	BALL
Terminal Pitch	1 mm	1 mm
Terminal Position	BOTTOM	BOTTOM
Width	33 mm	33 mm
Base Number Matches	3	2
Pbfree Code		No
Part Package Code		BGA
Pin Count		780
Moisture Sensitivity Level		4
Peak Reflow Temperature (Cel)		220
Time@Peak Reflow Temperature-Max (s)		20
	Programmable Logic » Field Programmable Gate Arrays	Programmable Logic » Field Programmable Gate Arrays