EP4SGX360FF35I4N vs EP4SGX360FF35C4 feature comparison

EP4SGX360FF35I4N Altera Corporation

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EP4SGX360FF35C4 Intel Corporation

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Pbfree Code Yes
Rohs Code Yes No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer ALTERA CORP INTEL CORP
Part Package Code BGA
Package Description 35 X 35 MM, LEAD FREE, FBGA-1152 35 X 35 MM, FBGA-1152
Pin Count 1152
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 717 MHz 717 MHz
JESD-30 Code S-PBGA-B1152 S-PBGA-B1152
JESD-609 Code e1 e0
Length 35 mm 35 mm
Moisture Sensitivity Level 3
Number of CLBs 14144 14144
Number of Inputs 564 564
Number of Logic Cells 353600 353600
Number of Outputs 564 564
Number of Terminals 1152 1152
Organization 14144 CLBS 14144 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA1152,34X34,40 BGA1152,34X34,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 245
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.4 mm 3.4 mm
Supply Voltage-Max 0.93 V 0.93 V
Supply Voltage-Min 0.87 V 0.87 V
Supply Voltage-Nom 0.9 V 0.9 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Finish TIN SILVER COPPER TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 35 mm 35 mm
Base Number Matches 2 2
Operating Temperature-Max 85 °C
Operating Temperature-Min
Temperature Grade OTHER

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Compare EP4SGX360FF35C4 with alternatives