EP4SGX360FF35C2X vs EP4SGX360FF35C2XN feature comparison

EP4SGX360FF35C2X Intel Corporation

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EP4SGX360FF35C2XN Intel Corporation

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Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEL CORP INTEL CORP
Package Description 35 X 35 MM, FBGA-1152 35 X 35 MM, LEAD FREE, FBGA-1152
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 800 MHz 800 MHz
JESD-30 Code S-PBGA-B1152 S-PBGA-B1152
JESD-609 Code e0 e1
Length 35 mm 35 mm
Number of CLBs 14144 14144
Number of Inputs 564 564
Number of Logic Cells 353600 353600
Number of Outputs 564 564
Number of Terminals 1152 1152
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min
Organization 14144 CLBS 14144 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA1152,34X34,40 BGA1152,34X34,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.4 mm 3.4 mm
Supply Voltage-Max 0.93 V 0.93 V
Supply Voltage-Min 0.87 V 0.87 V
Supply Voltage-Nom 0.9 V 0.9 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER OTHER
Terminal Finish TIN LEAD TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 35 mm 35 mm
Base Number Matches 2 2

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