EP4SGX180FF35C3N
vs
EP4SGX180HF35C3
feature comparison
All Stats
Differences Only
Pbfree Code
Yes
Rohs Code
Yes
No
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
ALTERA CORP
INTEL CORP
Part Package Code
BGA
Package Description
35 X 35 MM, LEAD FREE, FBGA-1152
FBGA-1152
Pin Count
1152
Reach Compliance Code
unknown
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Clock Frequency-Max
717 MHz
717 MHz
JESD-30 Code
S-PBGA-B1152
S-PBGA-B1152
JESD-609 Code
e1
e0
Length
35 mm
35 mm
Moisture Sensitivity Level
3
Number of CLBs
7030
70300
Number of Inputs
564
564
Number of Logic Cells
175750
175750
Number of Outputs
564
564
Number of Terminals
1152
1152
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
Organization
7030 CLBS
7030 CLBS
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA1152,34X34,40
BGA1152,34X34,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
245
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3.4 mm
3.6 mm
Supply Voltage-Max
0.93 V
0.93 V
Supply Voltage-Min
0.87 V
0.87 V
Supply Voltage-Nom
0.9 V
0.9 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
OTHER
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
Width
35 mm
35 mm
Base Number Matches
2
2
Compare EP4SGX180FF35C3N with alternatives
Compare EP4SGX180HF35C3 with alternatives